Materials Characterization Analysis
At EMSL Analytical, a wide variety of materials — metals, polymers, ceramics, semiconductors, and many others — can be analyzed for their elemental composition, phases, structure, and properties.
Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Energy Dispersive X-ray for elemental analysis, Light Microscopy (reflected, phase contrast polarized light), and Attenuated Total Reflection (FTIR interfaced with a light microscope ) are used for various types of microstructural analysis and phase identification.
For example, particles can be identified first with PLM (polarized light microscopy) and then further verified by SEM/EDX (energy-dispersive X-ray analysis); the grain- and microstructure of alloys can be determined with TEM; the defects in semiconductors can be checked by cross-section TEM analysis; the quality of wire-bonding can be examined by SEM inspection; the thickness of a thin film deposition can be characterized using a scanning AES (Auger electron spectrometer) to generate a depth profile.
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